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Ajouter le résultat dans votre panier Faire une suggestion Affiner la recherche Interroger des sources externesDigital fundamentals / Thomas L. Floyd (cop. 1997)
Titre : Digital fundamentals Type de document : texte imprime Auteurs : Thomas L. Floyd Mention d'édition : 7e éd. Editeur : Upper Saddle River : Pearson Prentice Hall Année de publication : cop. 1997 Importance : 828 p. Présentation : graph.,photos, tabl. Format : 29 cm +CD Rom ISBN/ISSN/EAN : 978-0-13-080850-9 Note générale : Index Langues : Anglais Mots-clés : Électronique numérique Circuits logiques Digital electronics Logic circuits Résumé : For mid-level courses in Digital Circuits (also called Digital Fundamentals or Digital Systems).
Reflecting 20 years' combined experience in engineering industry and in the classroom, this bestseller provides thorough, up-to-date coverage of digital fundamentals―from basic concepts to microprocessors. Floyd's acclaimed emphasis on applications using real devices and on troubleshooting gives students the problem-solving experience they'll need to compete in the professional arena. This practical text is known for its clear, accurate explanations of theory supported by superior exercises, examples, and visual aids. Its vivid full-color format is packed with the photographs, illustrations, tables, charts, and graphs today's students need to grasp concepts.
Note de contenu : 1. Introductory Digital Concepts.
2. Number Systems, Operations, and Codes.
3. Logic Gates.
4. Boolean Algebra and Logic Simplification.
5. Combinational Logic.
6. Functions of Combinational Logic.
7. Introduction to Programmable Logic Devices.
8. Flip-Flops and Related Devices.
9. Counters.
10. Shift Registers.
11. Sequential Logic Applications of PLDs.
12. Memory and Storage.
13. Interfacing.
14. Introduction to Microprocessors and Computers.
15. Integrated Circuit Technologies.
Appendix A: Data Sheets.
Appendix B: Conversions.
Answers to Selected Odd-Numbered Problems.
Glossary.
Index.En ligne : https://www.amazon.fr/Digital-Fundamentals-Thomas-L-Floyd/dp/0130808504/ref=sr_1 [...] Permalink : ./index.php?lvl=notice_display&id=10017 Digital fundamentals [texte imprime] / Thomas L. Floyd . - 7e éd. . - Upper Saddle River : Pearson Prentice Hall, cop. 1997 . - 828 p. : graph.,photos, tabl. ; 29 cm +CD Rom.
ISBN : 978-0-13-080850-9
Index
Langues : Anglais
Mots-clés : Électronique numérique Circuits logiques Digital electronics Logic circuits Résumé : For mid-level courses in Digital Circuits (also called Digital Fundamentals or Digital Systems).
Reflecting 20 years' combined experience in engineering industry and in the classroom, this bestseller provides thorough, up-to-date coverage of digital fundamentals―from basic concepts to microprocessors. Floyd's acclaimed emphasis on applications using real devices and on troubleshooting gives students the problem-solving experience they'll need to compete in the professional arena. This practical text is known for its clear, accurate explanations of theory supported by superior exercises, examples, and visual aids. Its vivid full-color format is packed with the photographs, illustrations, tables, charts, and graphs today's students need to grasp concepts.
Note de contenu : 1. Introductory Digital Concepts.
2. Number Systems, Operations, and Codes.
3. Logic Gates.
4. Boolean Algebra and Logic Simplification.
5. Combinational Logic.
6. Functions of Combinational Logic.
7. Introduction to Programmable Logic Devices.
8. Flip-Flops and Related Devices.
9. Counters.
10. Shift Registers.
11. Sequential Logic Applications of PLDs.
12. Memory and Storage.
13. Interfacing.
14. Introduction to Microprocessors and Computers.
15. Integrated Circuit Technologies.
Appendix A: Data Sheets.
Appendix B: Conversions.
Answers to Selected Odd-Numbered Problems.
Glossary.
Index.En ligne : https://www.amazon.fr/Digital-Fundamentals-Thomas-L-Floyd/dp/0130808504/ref=sr_1 [...] Permalink : ./index.php?lvl=notice_display&id=10017 Exemplaires
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Titre : Design of embedded systems using 68HC12 Type de document : texte imprime Auteurs : Richard E. Haskell Editeur : Upper Saddle River : Pearson Prentice Hall Année de publication : 1999 Importance : 569 p. Présentation : ill. Format : 25 cm ISBN/ISSN/EAN : 978-0-13-083208-5 Note générale : Index Langues : Anglais Mots-clés : Embedded systems Motorola Microcontrollers Fuzzy control C++ Extensible language Branching Interrupts Conversions Résumé :
For a capstone design class for senior electrical and computer engineering students.
This is the first text to describe, in detail, the new Motorola 68HC12 microcontroller, how to program it, and how to design embedded systems using the 68HC12. It shows how WHYP (a version of Forth written specifically for this book) can be used to program the new 68HC12 microcontroller in an efficient and interactive way.
A bridge between the 68HC12 and the 68HC11―Focuses on the 68HC12, but includes material for (and provides software for) the older 68HC11.
A new version of Forth―WHYP (Words to Help You Program)―designed for use in embedded systems―WHYP can easily be installed on any 68HC12 system, including the most popular development boards from Motorola and Axiom Manufacturing. It consists of two parts-some 68HC12 subroutines that reside on the target system (typically an evaluation board) and a C++ program that runs on a PC and communicates with the 68HC12 target system through a serial line. It is a sub-routine threaded language, which means that WHYP words are just the names of 68HC12(11) subroutines. New WHYP words can be defined simply by stringing previously defined WHYP words together. The first five chapters of the text explain how to make the programming of the 68HC12 simple and interactive, and in the process develops the entire WHYP language from scratch, step by step. (The software is provided on disk with the text, and the latest versions of the software will be available on the author's web site.)
An abundance of worked examples and many chapter-end exercises―Ranges from simple reinforcing exercises to complete term projects. Some suggest significant design projects using some of the latest peripheral chips with references to specific web sites where data sheets can be obtained.
Users can see examples of complete designs and have quick references to data sheet URLs.
A detailed description of the new 68HC12 multiplication and division instructions.
Users can use the easier method (WHYP, Forth) for doing arithmetic, rather than using assembly language.
A chapter on Fuzzy Control―Provides a detailed description of fuzzy logic as well as a discussion of how to use the built-in 68HC12 fuzzy control instructions.
Develops special WHYP words that make it easier to design a fuzzy controller.
Complete C++ code for the WHYP host that runs on the PC―Provided with the book and described in Chs. 16 and 17. Includes both the C++ program that runs on the PC, and the 68HC12 assembly language program that runs on the target 68HC12 board.Note de contenu :
1. Introducing the 68HC12.
2. Subroutines and Stacks.
3. 68HC12 Arithmetic.
4. WHYP―An Extensible Language.
5. Branching and Looping.
6. Interrupts.
7. Parallel Interfacing.
8. The Serial Peripheral Interface (SPI).
9. Analog-to-Digital Converter.
10. Timers.
11. The Serial Communications Interface (SCI).
12. Strings and Number Conversions.
13. Program Control and Data Structures.
14. Fuzzy Control.
15. Special Topics.
16. WHYP12 C++ Classes.
17. WHYP12 C++ Main Program.
Appendix A. 68HC12 Instruction Set.
Appendix B. 68HC11 Instruction Set.
Appendix C. Loading WHYP on 68HC12 and 68HC11 Evaluation Boards.
Appendix D. WHYP12.ASM File.
Appendix E. WHYP12.HED Header File.
Appendix F. WHYP12.CFG Configuration File.
Appendix G. WHYP Glossary.
Appendix H. The WHYP Disk.
Permalink : ./index.php?lvl=notice_display&id=10018 Design of embedded systems using 68HC12 [texte imprime] / Richard E. Haskell . - Upper Saddle River : Pearson Prentice Hall, 1999 . - 569 p. : ill. ; 25 cm.
ISBN : 978-0-13-083208-5
Index
Langues : Anglais
Mots-clés : Embedded systems Motorola Microcontrollers Fuzzy control C++ Extensible language Branching Interrupts Conversions Résumé :
For a capstone design class for senior electrical and computer engineering students.
This is the first text to describe, in detail, the new Motorola 68HC12 microcontroller, how to program it, and how to design embedded systems using the 68HC12. It shows how WHYP (a version of Forth written specifically for this book) can be used to program the new 68HC12 microcontroller in an efficient and interactive way.
A bridge between the 68HC12 and the 68HC11―Focuses on the 68HC12, but includes material for (and provides software for) the older 68HC11.
A new version of Forth―WHYP (Words to Help You Program)―designed for use in embedded systems―WHYP can easily be installed on any 68HC12 system, including the most popular development boards from Motorola and Axiom Manufacturing. It consists of two parts-some 68HC12 subroutines that reside on the target system (typically an evaluation board) and a C++ program that runs on a PC and communicates with the 68HC12 target system through a serial line. It is a sub-routine threaded language, which means that WHYP words are just the names of 68HC12(11) subroutines. New WHYP words can be defined simply by stringing previously defined WHYP words together. The first five chapters of the text explain how to make the programming of the 68HC12 simple and interactive, and in the process develops the entire WHYP language from scratch, step by step. (The software is provided on disk with the text, and the latest versions of the software will be available on the author's web site.)
An abundance of worked examples and many chapter-end exercises―Ranges from simple reinforcing exercises to complete term projects. Some suggest significant design projects using some of the latest peripheral chips with references to specific web sites where data sheets can be obtained.
Users can see examples of complete designs and have quick references to data sheet URLs.
A detailed description of the new 68HC12 multiplication and division instructions.
Users can use the easier method (WHYP, Forth) for doing arithmetic, rather than using assembly language.
A chapter on Fuzzy Control―Provides a detailed description of fuzzy logic as well as a discussion of how to use the built-in 68HC12 fuzzy control instructions.
Develops special WHYP words that make it easier to design a fuzzy controller.
Complete C++ code for the WHYP host that runs on the PC―Provided with the book and described in Chs. 16 and 17. Includes both the C++ program that runs on the PC, and the 68HC12 assembly language program that runs on the target 68HC12 board.Note de contenu :
1. Introducing the 68HC12.
2. Subroutines and Stacks.
3. 68HC12 Arithmetic.
4. WHYP―An Extensible Language.
5. Branching and Looping.
6. Interrupts.
7. Parallel Interfacing.
8. The Serial Peripheral Interface (SPI).
9. Analog-to-Digital Converter.
10. Timers.
11. The Serial Communications Interface (SCI).
12. Strings and Number Conversions.
13. Program Control and Data Structures.
14. Fuzzy Control.
15. Special Topics.
16. WHYP12 C++ Classes.
17. WHYP12 C++ Main Program.
Appendix A. 68HC12 Instruction Set.
Appendix B. 68HC11 Instruction Set.
Appendix C. Loading WHYP on 68HC12 and 68HC11 Evaluation Boards.
Appendix D. WHYP12.ASM File.
Appendix E. WHYP12.HED Header File.
Appendix F. WHYP12.CFG Configuration File.
Appendix G. WHYP Glossary.
Appendix H. The WHYP Disk.
Permalink : ./index.php?lvl=notice_display&id=10018 Exemplaires
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Titre : Robotics : introduction,programming and projects Type de document : texte imprime Auteurs : James L. Fuller Mention d'édition : 2e ed. Editeur : Upper Saddle River : Pearson Prentice Hall Année de publication : 1998 Importance : 489 p. Présentation : ill. Format : 25 cm ISBN/ISSN/EAN : 978-0-13-095543-2 Note générale : Bibliogr.Index Langues : Anglais Mots-clés : Robotics Industrial robot Control unit Grippers Maintenance Operating system Résumé :
For courses in Introduction to Robots. More descriptive, less mathematical, and easier to read than other texts on the subject, this comprehensive, up-to-date introduction to robotics is designed to meet the needs of those with or without extensive technical background.Note de contenu :
I. AN INTRODUCTION TO ROBOTICS.
1. What Is a Robot?
2. The History of Robots.
3. Components of an Industrial Robot: Part I.
4. Components of an Industrial Robot: Part II.
5. End-of-Arm Tooling.
6. Sensors.
7. Applications for Industrial, Business, and Domestic Robots.
8. Robot Maintenance.
9. Robotics and Safety.
10. Artificial Intelligence.
11. Classification of Robots.
12. Justifying the Use of Robots.
13. The Future for Robots.
II. ROBOTICS PROGRAMMING PROBLEMS AND TECHNIQUES.
14. Operating Systems for Robots.
15. Robot Application Programming.
16. Carrying Out a Robotics Project.
17. Vision Systems.
18. Tactile Systems.
19. Proximity Sensors.
20. Speech.
III. ROBOTICS PROJECTS.
21. Construction of Simple Robot Projects.
Appendix A. Mechanics.
Appendix B. Electricity, Electronics, and Computer Fundamentals.
Appendix C. Robotics Organizations.
Appendix D. Robot Specifications.
Appendix E. PC Board Inspection Using a Stand-Alone Vision System.
Glossary.
Bibliography.
Index.Permalink : ./index.php?lvl=notice_display&id=10023 Robotics : introduction,programming and projects [texte imprime] / James L. Fuller . - 2e ed. . - Upper Saddle River : Pearson Prentice Hall, 1998 . - 489 p. : ill. ; 25 cm.
ISBN : 978-0-13-095543-2
Bibliogr.Index
Langues : Anglais
Mots-clés : Robotics Industrial robot Control unit Grippers Maintenance Operating system Résumé :
For courses in Introduction to Robots. More descriptive, less mathematical, and easier to read than other texts on the subject, this comprehensive, up-to-date introduction to robotics is designed to meet the needs of those with or without extensive technical background.Note de contenu :
I. AN INTRODUCTION TO ROBOTICS.
1. What Is a Robot?
2. The History of Robots.
3. Components of an Industrial Robot: Part I.
4. Components of an Industrial Robot: Part II.
5. End-of-Arm Tooling.
6. Sensors.
7. Applications for Industrial, Business, and Domestic Robots.
8. Robot Maintenance.
9. Robotics and Safety.
10. Artificial Intelligence.
11. Classification of Robots.
12. Justifying the Use of Robots.
13. The Future for Robots.
II. ROBOTICS PROGRAMMING PROBLEMS AND TECHNIQUES.
14. Operating Systems for Robots.
15. Robot Application Programming.
16. Carrying Out a Robotics Project.
17. Vision Systems.
18. Tactile Systems.
19. Proximity Sensors.
20. Speech.
III. ROBOTICS PROJECTS.
21. Construction of Simple Robot Projects.
Appendix A. Mechanics.
Appendix B. Electricity, Electronics, and Computer Fundamentals.
Appendix C. Robotics Organizations.
Appendix D. Robot Specifications.
Appendix E. PC Board Inspection Using a Stand-Alone Vision System.
Glossary.
Bibliography.
Index.Permalink : ./index.php?lvl=notice_display&id=10023 Exemplaires
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Titre : Introduction to microelectronic fabrication. Vol.5 Type de document : texte imprime Auteurs : Richard C. Jaeger Mention d'édition : 2 ème èd. Editeur : Upper Saddle River : Pearson Prentice Hall Année de publication : cop. 2002 Collection : (Modular series on solid state devices) num. 5 Importance : 316 p. Présentation : ill. Format : 24 cm ISBN/ISSN/EAN : 978-0-201-44494-0 Note générale : Notes bibliogr. Index Langues : Français Mots-clés : Circuits intégrés à très grande échelle:conception et construction Résumé :
For courses in Theory and Fabrication of Integrated Circuits.
The author's goal in writing this text was to present a concise survey of the most up-to-date techniques in the field. It is devoted exclusively to processing, and is highlighted by careful explanations, clear, simple language, and numerous fully-solved example problems. This work assumes a minimal knowledge of integrated circuits and of terminal behavior of electronic components such as resistors, diodes, and MOS and bipolar transistors.
Introduction to Microelectronic Fabrication, Second Edition, by Richard C. Jaeger, is a concise survey of the most up-to-date techniques in the field. It is devoted exclusively to processing and is highlighted by careful explanations, clean, simple language, and numerous fully solved example problems.
The second edition includes an entirely new chapter on MEMS, as well as substantial modifications to the chapters on MOS and bipolar process integration. Also included is new or expanded coverage of lithography and exposure systems, trench isolation, chemical mechanical polishing, shallow junctions, transient enhanced diffusion, copper Damascene processes and process simulation.
For courses in Theory and Fabrication of Integrated Circuits.
The author's goal in writing this text was to present a concise survey of the most up-to-date techniques in the field. It is devoted exclusively to processing, and is highlighted by careful explanations, clear, simple language, and numerous fully-solved example problems. This work assumes a minimal knowledge of integrated circuits and of terminal behavior of electronic components such as resistors, diodes, and MOS and bipolar transistors.Note de contenu :
Preface.
1. An Overview of Microelectronic Fabrication.
A Historical Perspective. An Overview of Monolithic Fabrication Processes and Structures. Metal-Oxide-Semiconductor (MOS) Processes. Basic Bipolar Processing. Safety.
2. Lithography.
The Photolithographic Process. Etching Techniques. Photomask Fabrication. Exposure Systems. Exposure Sources. Optical and Electron Microscopy. Further Reading.
3. Thermal Oxidation of Silicon.
The Oxidation Process. Modeling Oxidation. Factors Influencing Oxidation Rate. Dopant Redistribution During Oxidation. Masking Properties of Silicon Dioxide. Technology of Oxidation. Oxide Quality. Selective Oxidation and Shallow Trench Formation. Oxide Thickness Characterization. Process Simulation.
4. Diffusion.
The Diffusion Process. Mathematical Model for Diffusion. The Diffusion Coefficient. Successive Diffusions. Solid-Solubility Limits. Junction Formation and Characterization. Sheet Resistance. Generation-Depth and Impurity Profile Measurement. Diffusion Simulation. Diffusion Systems. Gettering.
5. Ion Implantation.
Implantation Technology. Mathematical Model for Ion Implantation. Selective Implantation. Junction Depth and Sheet Resistance. Channeling, Lattice Damage, and Annealing. Shallow Implantation. Source Listing
6. Film Deposition.
Evaporation. Sputtering. Chemical Vapor Deposition. Epitaxy. Further Reading.
7. Interconnections and Contacts.
Interconnections in Integrated Circuits. Metal Interconnections and Contact Technology. Diffused Interconnections. Polysilicon Interconnections and Buried Contacts. Silicides and Multilayer-Contact Technology. The Liftoff Process. Multilevel Metallization. Copper Interconnects and Damascene Processes. Further Reading.
8. Packaging and Yield.
Testing. Wafer Thinning and Die Separation. Die Attachment. Wire Bonding. Packages. Flip-Chip and Tape-Automated-Bonding Processes. Yield. Further Reading.
9. MOS Process Integration.
Basic MOS Device Considerations. MOS Transistor Layout and Design Rules. Complementary MOS (CMOS) Technology. Silicon on Insulator.
10. Bipolar Process Integration.
The Junction-Isolated Structure. Current Gain. Transit Time. Basewidth. Breakdown Voltages. Other Elements in SBC Technology. Layout Considerations. Advanced Bipolar Structures. Other Bipolar Isolation Techniques. BICMOS.
11. Processes for Microelectromechanical Systems―MEMS.
Mechanical Properties of Silicon. Bulk Micromachining. Silicon Etchants. Surface Micromachining. High-Aspect-Ratio Micromachining: The LIGA Molding Process. Silicon Wafer Bonding. IC Process Compatibility.
Answers to Selected Problems.
Index.Permalink : ./index.php?lvl=notice_display&id=10320 Introduction to microelectronic fabrication. Vol.5 [texte imprime] / Richard C. Jaeger . - 2 ème èd. . - Upper Saddle River : Pearson Prentice Hall, cop. 2002 . - 316 p. : ill. ; 24 cm. - ((Modular series on solid state devices); 5) .
ISBN : 978-0-201-44494-0
Notes bibliogr. Index
Langues : Français
Mots-clés : Circuits intégrés à très grande échelle:conception et construction Résumé :
For courses in Theory and Fabrication of Integrated Circuits.
The author's goal in writing this text was to present a concise survey of the most up-to-date techniques in the field. It is devoted exclusively to processing, and is highlighted by careful explanations, clear, simple language, and numerous fully-solved example problems. This work assumes a minimal knowledge of integrated circuits and of terminal behavior of electronic components such as resistors, diodes, and MOS and bipolar transistors.
Introduction to Microelectronic Fabrication, Second Edition, by Richard C. Jaeger, is a concise survey of the most up-to-date techniques in the field. It is devoted exclusively to processing and is highlighted by careful explanations, clean, simple language, and numerous fully solved example problems.
The second edition includes an entirely new chapter on MEMS, as well as substantial modifications to the chapters on MOS and bipolar process integration. Also included is new or expanded coverage of lithography and exposure systems, trench isolation, chemical mechanical polishing, shallow junctions, transient enhanced diffusion, copper Damascene processes and process simulation.
For courses in Theory and Fabrication of Integrated Circuits.
The author's goal in writing this text was to present a concise survey of the most up-to-date techniques in the field. It is devoted exclusively to processing, and is highlighted by careful explanations, clear, simple language, and numerous fully-solved example problems. This work assumes a minimal knowledge of integrated circuits and of terminal behavior of electronic components such as resistors, diodes, and MOS and bipolar transistors.Note de contenu :
Preface.
1. An Overview of Microelectronic Fabrication.
A Historical Perspective. An Overview of Monolithic Fabrication Processes and Structures. Metal-Oxide-Semiconductor (MOS) Processes. Basic Bipolar Processing. Safety.
2. Lithography.
The Photolithographic Process. Etching Techniques. Photomask Fabrication. Exposure Systems. Exposure Sources. Optical and Electron Microscopy. Further Reading.
3. Thermal Oxidation of Silicon.
The Oxidation Process. Modeling Oxidation. Factors Influencing Oxidation Rate. Dopant Redistribution During Oxidation. Masking Properties of Silicon Dioxide. Technology of Oxidation. Oxide Quality. Selective Oxidation and Shallow Trench Formation. Oxide Thickness Characterization. Process Simulation.
4. Diffusion.
The Diffusion Process. Mathematical Model for Diffusion. The Diffusion Coefficient. Successive Diffusions. Solid-Solubility Limits. Junction Formation and Characterization. Sheet Resistance. Generation-Depth and Impurity Profile Measurement. Diffusion Simulation. Diffusion Systems. Gettering.
5. Ion Implantation.
Implantation Technology. Mathematical Model for Ion Implantation. Selective Implantation. Junction Depth and Sheet Resistance. Channeling, Lattice Damage, and Annealing. Shallow Implantation. Source Listing
6. Film Deposition.
Evaporation. Sputtering. Chemical Vapor Deposition. Epitaxy. Further Reading.
7. Interconnections and Contacts.
Interconnections in Integrated Circuits. Metal Interconnections and Contact Technology. Diffused Interconnections. Polysilicon Interconnections and Buried Contacts. Silicides and Multilayer-Contact Technology. The Liftoff Process. Multilevel Metallization. Copper Interconnects and Damascene Processes. Further Reading.
8. Packaging and Yield.
Testing. Wafer Thinning and Die Separation. Die Attachment. Wire Bonding. Packages. Flip-Chip and Tape-Automated-Bonding Processes. Yield. Further Reading.
9. MOS Process Integration.
Basic MOS Device Considerations. MOS Transistor Layout and Design Rules. Complementary MOS (CMOS) Technology. Silicon on Insulator.
10. Bipolar Process Integration.
The Junction-Isolated Structure. Current Gain. Transit Time. Basewidth. Breakdown Voltages. Other Elements in SBC Technology. Layout Considerations. Advanced Bipolar Structures. Other Bipolar Isolation Techniques. BICMOS.
11. Processes for Microelectromechanical Systems―MEMS.
Mechanical Properties of Silicon. Bulk Micromachining. Silicon Etchants. Surface Micromachining. High-Aspect-Ratio Micromachining: The LIGA Molding Process. Silicon Wafer Bonding. IC Process Compatibility.
Answers to Selected Problems.
Index.Permalink : ./index.php?lvl=notice_display&id=10320 Réservation
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